The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Jan. 13, 2012
Applicants:
Trent S. Uehling, New Braunfels, TX (US);
Lawrence S. Klingbeil, Chandler, AZ (US);
Mostafa Vadipour, Phoenix, AZ (US);
Brett P. Wilkerson, Austin, TX (US);
Leo M. Higgins, Iii, Austin, TX (US);
Inventors:
Trent S. Uehling, New Braunfels, TX (US);
Lawrence S. Klingbeil, Chandler, AZ (US);
Mostafa Vadipour, Phoenix, AZ (US);
Brett P. Wilkerson, Austin, TX (US);
Leo M. Higgins, III, Austin, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/036 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/11906 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01);
Abstract
A method forms a connecting pillar to a bonding pad of an integrated circuit. A seed layer is formed over the bond pad. Photoresist is deposited over the integrated circuit. An opening is formed in the photoresist over the bond pad. The connecting pillar is formed in the opening by plating.