The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Dec. 20, 2013
Applicant:
Intermolecular, Inc., San Jose, CA (US);
Inventors:
Owen Fong, San Jose, CA (US);
Timothy Franklin, Campbell, CA (US);
Stephen Charles Garner, Newark, CA (US);
James Tsung, Milpitas, CA (US);
Assignee:
Intermolecular, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); H01J 37/32 (2006.01); C23C 14/04 (2006.01); C23C 14/35 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
H01J 37/34 (2013.01); C23C 14/04 (2013.01); C23C 14/3407 (2013.01); C23C 14/3442 (2013.01); C23C 14/351 (2013.01); C23C 14/352 (2013.01); C23C 14/5826 (2013.01); C23C 14/5833 (2013.01); C23C 14/5846 (2013.01); H01J 37/32 (2013.01); H01J 37/32798 (2013.01); H01J 37/32935 (2013.01); B01J 2219/0043 (2013.01); B01J 2219/00443 (2013.01); B01J 2219/00745 (2013.01); B01J 2219/00756 (2013.01); H01J 2237/332 (2013.01);
Abstract
In some embodiments, apparatus are provided that provide for flexible processing in both high productivity combinatorial (HPC) and full wafer modes. The apparatus allow for interchangeable functionality that includes deposition with different sizes of targets, plasma treatment, ion beam treatment, and in-situ metrology. The functional modules are designed so that the modules may be interchanged with minimal effort and reduced system downtime.