The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Jan. 02, 2014
Applicant:

National Tsing Hua University, Hsin Chu, TW;

Inventors:

Meng-Fan Chang, Taichung, TW;

Tsung-Hsien Huang, Hsinchu, TW;

Pei-Yuan Li, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/003 (2006.01); H03K 19/08 (2006.01); H03K 19/00 (2006.01);
U.S. Cl.
CPC ...
H03K 19/0008 (2013.01); H03K 19/003 (2013.01); H03K 19/08 (2013.01);
Abstract

A method for 3D voltage type TSV signal transmission, comprising transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for data transmission to a master device. Then, full swing signal is sensed by the master device for reduce the first voltage to be a small swing signal with lower voltage. Logic '0' signals or logic '1' signals with the lower voltage are transmitted through the TSVs by the plurality of slave devices. It is sharing charge and balancing voltage level to a mean value for the logic “1” signals or the logic “0” signals by the master device.


Find Patent Forward Citations

Chang, Meng-Fan. (2016). Scheme for 3d voltage type tsv signal transmission (U.S. Patent No. 9312856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9312856

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