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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9307643 B1

PDFFull Text
Date of Patent:
Apr. 05, 2016

Filed:

Dec. 10, 2014

Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component

Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Hisayuki Nakagome, Ogaki, JP;

Toshiki Furutani, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01G 4/30 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H01G 4/33 (2006.01); H01G 4/40 (2006.01); H01G 4/232 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01G 4/12 (2006.01); C23C 18/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 23/13 (2013.01); H01L 23/48 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/4084 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01); C23C 18/00 (2013.01); H01G 4/12 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/0554 (2013.01);
Abstract

A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and multiple via conductors penetrating through the insulating layer and including a first via conductor reaching to the pattern on the substrate and a second via conductor reaching to the terminal of the component in the substrate. The pattern has a recessed connecting portion connected to the first via conductor, the terminal of the component has a recessed connecting portion connected to the second via conductor, and the recessed connecting portion of the pattern has depth which is greater than depth of the recessed connecting portion of the terminal.

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