The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Dec. 17, 2013
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/16 (2006.01); B24B 49/08 (2006.01); B24B 37/005 (2012.01); B24B 37/30 (2012.01); B24B 37/04 (2012.01); H01L 21/67 (2006.01); B24B 49/10 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/30 (2013.01); B24B 49/08 (2013.01); B24B 49/10 (2013.01); B24B 49/16 (2013.01); H01L 21/67219 (2013.01); H01L 21/02024 (2013.01);
Abstract
A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.