The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jan. 29, 2014
Applicant:

Globalfoundries, Inc., Grand Cayman, KY (US);

Inventors:

Shao Ming Koh, Clifton Park, NY (US);

Guillaume Bouche, Albany, NY (US);

Jeremy A. Wahl, Delmar, NY (US);

Andy C. Wei, Queensbury, NY (US);

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 27/092 (2006.01); H01L 21/311 (2006.01); H01L 29/45 (2006.01); H01L 21/8238 (2006.01); H01L 29/16 (2006.01); H01L 29/167 (2006.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/31111 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823871 (2013.01); H01L 27/0922 (2013.01); H01L 29/16 (2013.01); H01L 29/161 (2013.01); H01L 29/167 (2013.01); H01L 29/45 (2013.01); H01L 29/456 (2013.01);
Abstract

Integrated circuits having silicide contacts with reduced contact resistance and methods for fabricating integrated circuits having silicide contacts with reduced contact resistance are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate having selected source/drain regions and non-selected source/drain regions. The method forms a contact resistance modulation material over the selected source/drain regions. Further, the method forms a metal layer over the selected and non-selected source/drain regions. The method includes annealing the metal layer to form silicide contacts on the selected and non-selected source/drain regions.


Find Patent Forward Citations

Loading…