The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Jan. 13, 2012
Applicants:
Hidenori Miyoshi, Nirasaki, JP;
Masamichi Hara, Nirasaki, JP;
Inventors:
Hidenori Miyoshi, Nirasaki, JP;
Masamichi Hara, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H01L 23/532 (2006.01); C23C 16/16 (2006.01); C23C 16/18 (2006.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); C23C 16/02 (2013.01); C23C 16/0236 (2013.01); C23C 16/04 (2013.01); C23C 16/042 (2013.01); C23C 16/16 (2013.01); C23C 16/18 (2013.01); C23C 16/405 (2013.01); H01L 21/28556 (2013.01); H01L 21/76849 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Disclosed is a film-forming method wherein a manganese-containing film is formed on a substrate having a surface to which an insulating film and a copper wiring line are exposed. The film-forming method includes forming a manganese-containing film on the copper wiring line by a CVD method which uses a manganese compound.