The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Oct. 12, 2011
Applicants:

Hao-juin Liu, Kaohsiung, TW;

Chita Chuang, Kaohsiung, TW;

Chen-cheng Kuo, Chu-Pei, TW;

Chen-shien Chen, Zhubei, TW;

Inventors:

Hao-Juin Liu, Kaohsiung, TW;

Chita Chuang, Kaohsiung, TW;

Chen-Cheng Kuo, Chu-Pei, TW;

Chen-Shien Chen, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/36 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/563 (2013.01); H01L 23/3142 (2013.01); H01L 23/36 (2013.01); H01L 23/42 (2013.01); H01L 23/49838 (2013.01); H01L 24/32 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/181 (2013.01);
Abstract

An embodiment is a structure. The structure comprises a substrate, a chip, and a reinforcement component. The substrate has a first surface, and the first surface comprises depressions. The chip is over and attached to the first surface of the substrate. The reinforcement component is over a first area of the first surface of the substrate. The first area is not under the chip. The reinforcement component has a portion disposed in at least some of the depressions in the first area.


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