The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Jun. 29, 2015
International Business Machines Corporation, Armonk, NY (US);
Griselda Bonilla, Hopewell Junction, NY (US);
Baozhen Li, South Burlington, VT (US);
Barry P. Linder, Hastings-On-Hudson, NY (US);
James H. Stathis, Poughquag, NY (US);
Ernest Y. Wu, Essex Junction, VT (US);
Kai Zhao, Hopewell Junction, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
Methods and systems determine an original statistical variance of an original failure distribution of a component (that is common to all chips tested) that occurs during manufacturing of wafers containing such chips. These methods and systems determine a first statistical variance of a reconstructed failure distribution, relative to sample size; and determine a second statistical variance of a mean time to failure of the component, relative to sample size. The first and second statistical variances are combined into a total reconstruction variance. Methods and systems determine whether the original statistical variance is less than the total reconstruction variance to identify whether the process of creating the reconstructed failure distribution can be used. Therefore, these methods and systems prohibit testing of the additional wafers manufactured using the specific wafer design and manufacturing process when on the original statistical variance is less than the total reconstruction variance.