The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Aug. 15, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hsin-Kai Chen, Dounan Township, TW;

Hung-Chih Wang, Hsinchu, TW;

Hon-Lin Huang, Hsinchu, TW;

Shih-Chi Lin, HsinChu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); C30B 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67748 (2013.01); H01L 21/67115 (2013.01); C30B 25/105 (2013.01);
Abstract

A semiconductor baking apparatus includes a load lock chamber, a process chamber, a transfer chamber, a first interior door, and a controller. The process chamber has a first accommodating space therein. The transfer chamber has a second accommodating space therein, and the transfer chamber is connected to the load lock chamber and the process chamber. The first interior door is between the process chamber and the transfer chamber. When the first interior door is opened, the first accommodating space is communicated with the second accommodating space. The controller is programmed to open the first interior door when the semiconductor baking apparatus idles.


Find Patent Forward Citations

Loading…