The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Sep. 28, 2011
Applicants:

Dmitry Lubomirsky, Cupertino, CA (US);

Jay D. Pinson, Ii, San Jose, CA (US);

Kirby H. Floyd, San Jose, CA (US);

Adib Khan, Santa Clara, CA (US);

Shankar Venkataraman, San Jose, CA (US);

Inventors:

Dmitry Lubomirsky, Cupertino, CA (US);

Jay D. Pinson, II, San Jose, CA (US);

Kirby H. Floyd, San Jose, CA (US);

Adib Khan, Santa Clara, CA (US);

Shankar Venkataraman, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 25/00 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); C23C 16/40 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
F26B 25/004 (2013.01); C23C 16/56 (2013.01); H01L 21/6719 (2013.01); H01L 21/67178 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); C23C 16/401 (2013.01); H01L 21/02126 (2013.01); H01L 21/02337 (2013.01); H01L 21/3105 (2013.01);
Abstract

A substrate processing system that has a plurality of deposition chambers, and one or more robotic arms for moving a substrate between one or more of a deposition chamber, load lock holding area, and a curing and treatment module. The substrate curing and treatment module is attached to the load-lock substrate holding area, and may include: The curing chamber for curing a dielectric layer in an atmosphere comprising ozone, and a treatment chamber for treating the cured dielectric layer in an atmosphere comprising water vapor. The chambers may be vertically aligned, have one or more access doors, and may include a heating system to adjust the curing and/or heating chambers between two or more temperatures respectively.


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