The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Jun. 27, 2013
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Jinsu Kwon, Campbell, CA (US);

Kimitaka Endo, Tokyo, JP;

Sean P. Moran, Burlingame, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 9/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H05K 3/4007 (2013.01); H01L 24/05 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 3/205 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/0384 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01); Y10T 29/49204 (2015.01);
Abstract

An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.


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