The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Aug. 12, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Roger A. Booth, Jr., Wappingers Falls, NY (US);

Kangguo Cheng, Guilderland, NY (US);

Chandrasekara Kothandaraman, Hopewell Junction, NY (US);

Chengwen Pei, Danbury, CT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/336 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 27/115 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/105 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/28282 (2013.01); H01L 27/1052 (2013.01); H01L 27/11573 (2013.01); H01L 29/4234 (2013.01); H01L 29/4983 (2013.01); H01L 29/517 (2013.01); H01L 29/6659 (2013.01); H01L 29/66833 (2013.01); H01L 29/792 (2013.01); H01L 21/823462 (2013.01); H01L 21/823468 (2013.01);
Abstract

A method of fabricating a memory device is provided that may begin with forming a layered gate stack atop a semiconductor substrate and patterning a metal electrode layer stopping on the high-k gate dielectric layer of the layered gate stack to provide a first metal gate electrode and a second metal gate electrode on the semiconductor substrate. In a next process sequence, at least one spacer is formed on the first metal gate electrode atop a portion of the high-k gate dielectric layer, wherein a remaining portion of the high-k gate dielectric is exposed. The remaining portion of the high-k gate dielectric layer is etched to provide a first high-k gate dielectric having a portion that extends beyond a sidewall of the first metal gate electrode and a second high-k gate dielectric having an edge that is aligned to a sidewall of the second metal gate electrode.


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