The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Sep. 17, 2014
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Yan Xun Xue, Los Gatos, CA (US);
Jun Lu, San Jose, CA (US);
Lei Shi, Shanghai, CN;
Liang Zhao, Shanghai, CN;
Ping Huang, Shanghai, CN;
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Abstract
A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies.