The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Jan. 15, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Alok Vaid, Ballston Lake, NY (US);

Abner Bello, Clifton Park, NY (US);

Sipeng Gu, Clifton Park, NY (US);

Lokesh Subramany, Clifton Park, NY (US);

Xiang Hu, Clifton Park, NY (US);

Akshey Sehgal, Malta, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01B 11/02 (2006.01); G01B 11/06 (2006.01); G03F 7/20 (2006.01); G01N 21/21 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01B 11/02 (2013.01); G01B 11/065 (2013.01); G01B 11/0633 (2013.01); G03F 7/70616 (2013.01); G03F 7/70625 (2013.01); G01B 2210/56 (2013.01); G01N 21/211 (2013.01);
Abstract

Measurement of thickness of layers of a circuit structure is obtained, where the thickness of the layers is measured using an optical critical dimension (OCD) measurement technique, and the layers includes a high-k layer and an interfacial layer. Measurement of thickness of the high-k layer is separately obtained, where the thickness of the high-k layer is measured using a separate measurement technique from the OCD measurement technique. The separate measurement technique provides greater decoupling, as compared to the OCD measurement technique, of a signal for thickness of the high-k layer from a signal for thickness of the interfacial layer of the layers. Characteristics of the circuit structure, such as a thickness of the interfacial layer, are ascertained using, in part, the separately obtained thickness measurement of the high-k layer.


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