The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Dec. 31, 2014
Applicants:

Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventors:

Ming-Jaan Ho, New Taipei, TW;

Xian-Qin Hu, Shenzhen, CN;

Fu-Yun Shen, Shenzhen, CN;

Yi-Qiang Zhuang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0219 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09509 (2013.01); Y10T 156/1057 (2015.01);
Abstract

A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.


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