The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

May. 03, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Edward Fuergut, Dasing, DE;

Irmgard Escher-Poeppel, Duggendorf, DE;

Manfred Engelhardt, Villach-Landskron, AT;

Hans-Joerg Timme, Ottobrunn, DE;

Hannes Eder, Villach-Landskron, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/784 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 22/24 (2013.01); H01L 21/67069 (2013.01); H01L 21/67253 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/784 (2013.01); H01L 22/26 (2013.01); H01L 22/30 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/568 (2013.01); H01L 22/12 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01);
Abstract

A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.


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