The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Mar. 29, 2012
Applicants:

Chien-an Chen, Zhubei, TW;

Wen-jiun Liu, Zhunan Township, TW;

Chun-chieh Lin, Taichung, TW;

Hung-wen Su, Jhubei, TW;

Ming-hsing Tsai, Chu-Pei, TW;

Syun-ming Jang, Hsinchu, TW;

Inventors:

Chien-An Chen, Zhubei, TW;

Wen-Jiun Liu, Zhunan Township, TW;

Chun-Chieh Lin, Taichung, TW;

Hung-Wen Su, Jhubei, TW;

Ming-Hsing Tsai, Chu-Pei, TW;

Syun-Ming Jang, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76819 (2013.01); H01L 21/76834 (2013.01); H01L 21/76847 (2013.01); H01L 21/76849 (2013.01); H01L 21/76864 (2013.01); H01L 21/76882 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An interconnect structure includes a first trench and a second trench. The second trench is wider than the first trench. Both trenches are lined with a diffusion barrier layer, and a first conductive layer is deposited over the diffusion barrier layer. A metal cap layer is deposited over the first conductive layer. A second conductive layer is deposited over the metal cap layer in the second trench.


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