The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Apr. 06, 2012
Applicants:

Akimasa Kinoshita, Tsukuba, JP;

Takashi Tsuji, Tsukuba, JP;

Fumikazu Imai, Tsukuba, JP;

Inventors:

Akimasa Kinoshita, Tsukuba, JP;

Takashi Tsuji, Tsukuba, JP;

Fumikazu Imai, Tsukuba, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/3205 (2006.01); H01L 21/04 (2006.01); H01L 29/16 (2006.01); H01L 29/45 (2006.01); H01L 29/47 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0485 (2013.01); H01L 29/1608 (2013.01); H01L 29/45 (2013.01); H01L 29/47 (2013.01); H01L 29/6606 (2013.01); H01L 29/872 (2013.01);
Abstract

A surface of a silicon carbide substrate on which a graphite layer is formed is covered with a metal layer which can form carbide. Then, the silicon carbide substrate is annealed to cause reaction between a metal in the metal layer which can form carbide and carbon in the graphite layer so as to change the graphite layer between the metal layer which can form carbide and the silicon carbide substrate to a metal carbide layer. Thus, the graphite layer is removed. The adhesion between the metal layer which can form carbide and the silicon carbide substrate can be improved so that separation of the metal layer which can form carbide can be suppressed. Graphite deposits can be suppressed due to the removal of the graphite layer so that separation of a wiring metal film formed on a surface of the metal layer which can form carbide can be suppressed.


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