The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

May. 19, 2011
Applicants:

Yusuke Asano, Tokyo, JP;

Yoshifumi Oizumi, Tokyo, JP;

Akimasa Soyano, Tokyo, JP;

Takeshi Ishii, Tokyo, JP;

Inventors:

Yusuke Asano, Tokyo, JP;

Yoshifumi Oizumi, Tokyo, JP;

Akimasa Soyano, Tokyo, JP;

Takeshi Ishii, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 18/20 (2006.01); G03F 7/039 (2006.01); G03F 7/20 (2006.01); G03F 7/004 (2006.01); C08F 220/26 (2006.01); G03F 7/038 (2006.01); C07C 69/653 (2006.01); C07C 69/753 (2006.01); C07D 307/93 (2006.01); C08F 22/18 (2006.01); C08F 24/00 (2006.01); C08F 220/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); C07C 69/653 (2013.01); C07C 69/753 (2013.01); C07D 307/93 (2013.01); C08F 22/18 (2013.01); C08F 24/00 (2013.01); C08F 220/26 (2013.01); G03F 7/0046 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/2041 (2013.01); C08F 220/24 (2013.01);
Abstract

A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a polymer having a structural unit (I) represented by the following formula (1), and (B) a radiation-sensitive acid generator.


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