The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Sep. 23, 2014
Applicants:

Sinmat, Inc., Gainesville, FL (US);

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Inventors:

Rajiv K. Singh, Newberry, FL (US);

Deepika Singh, Newberry, FL (US);

Arul Chakkaravarthi Arjunan, Gainesville, FL (US);

Assignees:

Sinmat, inc., Gainesville, FL (US);

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 29/02 (2006.01); B32B 33/00 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01); H01L 21/311 (2006.01); B28D 5/00 (2006.01); C30B 29/04 (2006.01); C30B 33/00 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
B24B 29/02 (2013.01); B28D 5/00 (2013.01); B32B 33/00 (2013.01); C09G 1/02 (2013.01); C09K 3/1463 (2013.01); C30B 29/04 (2013.01); C30B 33/00 (2013.01); H01L 21/30625 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); Y10T 428/31 (2015.01);
Abstract

A method of chemical mechanical polishing (CMP) a diamond containing surface includes providing a slurry including a plurality of particles, at least one oxidizer, and at least one acid, wherein the slurry has a pH≦3 or pH greater than 11. At least an outer surface of the plurality of particles is softer than the diamond surface or the particles are diamond particles averaging less than (<) 2 μm in size. The diamond surface is pressed with respect to a polishing pad providing a Shore D Hardness less than 99 having the slurry in between while rotating the polishing pad relative to the diamond surface to form a smooth diamond surface having a root mean square (rms) surface roughness less than 15 nm.


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