The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Mar. 30, 2011
Applicants:

Ian J Brown, Austin, TX (US);

Wallace P Printz, Austin, TX (US);

Inventors:

Ian J Brown, Austin, TX (US);

Wallace P Printz, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/08 (2006.01); B08B 13/00 (2006.01); H01L 21/308 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/265 (2006.01); B08B 3/04 (2006.01); B08B 3/02 (2006.01); B08B 3/00 (2006.01); B08B 9/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30612 (2013.01); H01L 21/31111 (2013.01); H01L 21/67086 (2013.01); B08B 3/00 (2013.01); B08B 3/024 (2013.01); B08B 3/04 (2013.01); B08B 3/08 (2013.01); B08B 9/08 (2013.01); B08B 2203/007 (2013.01); H01L 21/02041 (2013.01); H01L 21/02052 (2013.01); H01L 21/02057 (2013.01); H01L 21/26506 (2013.01); H01L 21/30604 (2013.01); H01L 21/31133 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67057 (2013.01);
Abstract

Provided is a method and system for increasing etch rate and etch selectivity of a masking layer on a substrate in an etch treatment system, the etch treatment system configured for single substrate processing. The method comprises obtaining a supply of steam water vapor mixture at elevated pressure, obtaining a supply of treatment liquid for selectively etching the masking layer over the silicon or silicon oxide at a set etch selectivity ratio, placing the substrate into the etch processing chamber, combining the treatment liquid and the steam water vapor mixture, and injecting the combined treatment liquid and the steam water vapor mixture into the etch processing chamber, wherein the flow of the combined treatment liquid and the steam water vapor mixture is controlled to maintain a set etch rate and a set etch selectivity ratio of the masking layer to silicon or silicon oxide.


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