The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Dec. 18, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Yoko Maeda, Itami, JP;

Fumitaka Sato, Itami, JP;

Akihiro Hachigo, Itami, JP;

Seiji Nakahata, Itami, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 29/20 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 29/0603 (2013.01); H01L 21/76254 (2013.01); H01L 29/2003 (2013.01); H01L 33/0079 (2013.01);
Abstract

An epitaxial-deposition composite substrate, of more than about 50 mm diameter, in which a nitride-compound semiconductor first substrate is bonded together with a second substrate of either identical or different material. The first substrate is ion-implanted, and on its nitrogen-face side is coated with a special film of thickness within a predetermined range. On a bonding side of the second substrate a special coating of thickness within the predetermined range is formed. The join created by the coated nitrogen-face side of the first substrate being bonded to the coated bonding side of the second substrate occupies at least 90% of the surface area where the two substrates meet.


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