The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Sep. 17, 2014
Applicant:

Intermolecular, Inc., San Jose, CA (US);

Inventors:

Anh Duong, Fremont, CA (US);

Tony Chiang, Campbell, CA (US);

Zachary M. Fresco, Santa Rosa, CA (US);

Nitin Kumar, Fremont, CA (US);

Chi-I Lang, Cupertino, CA (US);

Jinhong Tong, Santa Clara, CA (US);

Anna Tsizelmon, Mountain View, CA (US);

Assignee:

Intermolecular, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); C09D 129/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); C09D 129/04 (2013.01); H01L 21/02063 (2013.01); H01L 21/02074 (2013.01); H01L 21/3105 (2013.01); H01L 21/31058 (2013.01); H01L 21/7682 (2013.01); H01L 21/76814 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); H01L 2221/1063 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.


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