The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Jan. 28, 2013
Applicant:
Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Shiv Kumar, Saharanpur, IN;
Chin-Tien Chiu, Taichung, TW;
Kaiyou Qian, Shanghai, CN;
Cheeman Yu, Fremont, CA (US);
Assignee:
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/13 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 24/24 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/24247 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48482 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82105 (2013.01); H01L 2224/85 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor device includes a substrate () with a cavity () formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (). The controller die () may be electrically connected to the substrate () with electrical traces () which may be formed for example by printing. After the controller die () is electrically connected to the substrate (), one or more memory die () may be affixed to the substrate (), over the cavity () and controller die ().