The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
May. 17, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Jing-Cheng Lin, Hsin-Chu, TW;
Cheng-Lin Huang Huang, Hsin-Chu, TW;
Wei-An Tsao, Yuanlin Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment method of forming and a bump structure are disclosed. The bump structure includes a passivation layer formed over a metal pad, the passivation layer having a recess exposing a portion of the metal pad, and a metal bump formed over the metal pad, the metal bump having a lip extending beneath the passivation layer, the lip anchoring the metal bump to the passivation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile