The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jul. 02, 2014
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Ting-Ying Chien, Hsinchu, TW;
I-Shi Wang, New Taipei, TW;
Jen-Hao Liu, Zhunan Township, TW;
Ren-Dou Lee, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes a first wafer and a second wafer. The first wafer has a concave portion. The concave portion has a bottom surface and at least one sidewall adjacent to the bottom surface. An obtuse angle is formed between the bottom surface and the sidewall. The second wafer is disposed on the first wafer and has a protruding portion. When the protruding portion enters an opening of the concave portion, the protruding portion slides along the sidewall to the bottom surface, such that the protruding portion is coupled to the concave portion.