The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Jul. 08, 2013
Marvell International Ltd., Hamilton, BM;
Shiann-Ming Liou, Campbell, CA (US);
Chenglin Liu, San Jose, CA (US);
Marvell International Ltd., Hamilton, BM;
Abstract
Semiconductor packages and associated techniques are described. A described semiconductor package includes a lead frame; a first wire bond; a second wire bond; a first voltage source to provide a first voltage; a second voltage source to provide a second voltage; a first die pad coupled with the first voltage source via the first wire bond; a second die pad coupled with the second voltage source via the second wire bond; a first die disposed on the first die pad; a second die disposed on the second die pad; and an encapsulant. The first die pad and the second die pad can be electrically isolated from each other such that the first die pad is maintainable at a first potential associated with the first voltage source and the second die pad is maintainable at a second potential associated with the second voltage source.