The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jul. 09, 2007
Applicants:

Byung-jin Choi, Austin, TX (US);

Sidlgata V. Sreenivasan, Austin, TX (US);

Carlton Grant Willson, Austin, TX (US);

Mattherw E. Colburn, Hopewell Junction, NY (US);

Todd C. Bailey, Fishkill, NY (US);

John G. Ekerdt, Austin, TX (US);

Inventors:

Byung-Jin Choi, Austin, TX (US);

Sidlgata V. Sreenivasan, Austin, TX (US);

Carlton Grant Willson, Austin, TX (US);

Mattherw E. Colburn, Hopewell Junction, NY (US);

Todd C. Bailey, Fishkill, NY (US);

John G. Ekerdt, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/16 (2013.01); G03F 7/164 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/3016 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/1461 (2013.01);
Abstract

Disclosed herein is an automatic fluid dispensing method and system for dispensing fluid on the surface of a plate-like material, or substrate, including a semiconductor wafer for imprint lithography processes. The dispensing method uses fluid dispenser and a substrate stage that may generate relative lateral motions between a fluid dispenser tip a substrate. Also described herein are methods and devices for creating a planar surface on a substrate using a substantially unpatterned planar template.


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