The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Feb. 17, 2015
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Noriyoshi Shimizu, Nagano, JP;
Masato Tanaka, Nagano, JP;
Toshinori Koyama, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Abstract
A wiring substrate includes a first wiring structure, a second wiring structure stacked on an upper surface of the first wiring structure, and an outermost insulating layer stacked on a lower surface of the first wiring structure. The outermost insulating layer covers a part of a bottom wiring layer of the wiring layers forming the first wiring structure. The second wiring structure has a wiring density higher than that of the first wiring structure. A volume ratio V/Vis from 0.8 to 1.5, where Vrepresents the volume of the wiring layers forming the entire second wiring structure, and Vrepresents the volume of the bottom wiring layer in the first wiring structure.