The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Dec. 13, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Rudolf Berger, Regensburg, DE;
Guenther Ruhl, Regensburg, DE;
Wolfgang Lehnert, Lintach, DE;
Roland Rupp, Lauf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 21/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83055 (2013.01); H01L 2224/83099 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/1026 (2013.01);
Abstract
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a ceramic-forming polymer precursor.