The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Jun. 13, 2014
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Yun-Hsiang Tien, Kaohsiung, TW;
Yi-Chuan Ding, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
The present disclosure provides a substrate and a semiconductor package. The substrate includes a body, at least one pad group, a plurality of traces and at least one pillar group. The pad group includes a plurality of pads. Each pad has at least one inner side and at least one outer side. The inner side of a first pad is faced to the inner side of an adjacent second pad with a spaced section between. Each pillar group includes a plurality of pillars disposed on respective ones of the pads. The use of pad groups having multiple pads on which to form pillars allows an increase in the number of the pillars available in a given area so as to increase the amount of I/O connections. Furthermore, for a given number of I/O connections, the area occupied by the pads, pillars and traces can be reduced.