The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Aug. 20, 2012
Applicants:
Hiromasa Kato, Fujisawa, JP;
Takayuki Naba, Chigasaki, JP;
Noritaka Nakayama, Yokohama, JP;
Inventors:
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA MATERIALS CO., LTD., Yokohama-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 35/30 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 35/30 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 1/0201 (2013.01); H05K 1/18 (2013.01); H01L 24/32 (2013.01); H01L 2224/29 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83805 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01105 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/351 (2013.01); H05K 3/3463 (2013.01);
Abstract
An electronic component module has a circuit board in which metal plates are bonded to both surfaces of a ceramic substrate, and an electronic component that is bonded to at least one surface of the metal plate and is operable at least 125° C. The electronic component is bonded to the metal plate via a brazing material layer having a higher melting point than a operating temperature of the electronic component.