The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Jul. 18, 2014
Applicants:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Jui-Lin Chu, New Taipei, TW;

Ming-Hwei Hong, Hsinchu, TW;

Juei-Nai Kwo, Hsinchu, TW;

Tun-Wen Pi, Hsinchu County, TW;

Jen-Inn Chyi, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 29/201 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 29/201 (2013.01); H01L 21/0228 (2013.01); H01L 21/02057 (2013.01); H01L 21/02178 (2013.01); H01L 21/02192 (2013.01); H01L 21/02266 (2013.01); H01L 21/02398 (2013.01); H01L 21/02549 (2013.01); H01L 21/02631 (2013.01); H01L 21/28264 (2013.01); H01L 21/324 (2013.01); H01L 29/517 (2013.01); H01L 29/66522 (2013.01); H01L 29/78 (2013.01);
Abstract

Disclosed is a wafer comprising a first layer of GaSb grown on a GaSb substrate by molecular beam epitaxy (MBE), an oxide layer deposited on the surface of the first layer, and a cap layer deposited on the surface of the oxide layer. The wafer was capped with an arsenic (As) layer after the growth of the first layer. The As layer was removed from the wafer before the oxide layer was deposited on the surface of the first layer. Also disclosed is a method of forming a wafer. The method comprises growing a first layer of GaSb on a GaSb substrate by MBE, capping the wafer with an As layer after the growth of the first layer, removing the As layer from the wafer, depositing an oxide layer on the surface of the first layer, and depositing a cap layer on the surface of the oxide layer.


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