The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Feb. 11, 2008
Applicants:

Masakazu Higuma, Nirasaki, JP;

Yasuharu Sasaki, Nirasaki, JP;

Tadashi Aoto, Nirasaki, JP;

Eiichiro Kikuchi, Nirasaki, JP;

Inventors:

Masakazu Higuma, Nirasaki, JP;

Yasuharu Sasaki, Nirasaki, JP;

Tadashi Aoto, Nirasaki, JP;

Eiichiro Kikuchi, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01); C23C 16/458 (2006.01); H01L 21/673 (2006.01); H01J 37/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); C23C 16/4581 (2013.01); H01J 37/20 (2013.01); H01L 21/67366 (2013.01); H01L 21/6875 (2013.01);
Abstract

A substrate mounting stage that prevents poor attraction of substrates so as to improve the operating rate of a substrate processing apparatus. The substrate mounting stage is disposed in the substrate processing apparatus and has a substrate mounting surface on which a substrate is mounted. The arithmetic average roughness (Ra) of the substrate mounting surface is not less than a first predetermined value, and the initial wear height (Rpk) of the substrate mounting surface is not more than a second predetermined value.


Find Patent Forward Citations

Loading…