The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Aug. 08, 2012
Applicants:
Chia-hao Hsu, Hsinchu, TW;
Kipling Yeh, Pingzhen, TW;
Chia-ching Huang, Su-ao Township, Yilan County, TW;
Inventors:
Chia-Hao Hsu, Hsinchu, TW;
Kipling Yeh, Pingzhen, TW;
Chia-Ching Huang, Su-ao Township, Yilan County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); H01L 21/67109 (2013.01); Y10T 137/0318 (2015.04); Y10T 279/11 (2015.01);
Abstract
A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.