The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Feb. 18, 2014
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Shankar Swaminathan, Beaverton, OR (US);

Ananda Banerji, West Linn, OR (US);

Nagraj Shankar, Tualatin, OR (US);

Adrien LaVoie, Newberg, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/314 (2006.01); C23C 16/52 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 16/458 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); H01L 21/02178 (2013.01); H01L 21/02274 (2013.01); H01L 21/28194 (2013.01); H01L 21/3141 (2013.01);
Abstract

Methods of depositing conformal aluminum nitride films on semiconductor substrates are provided. Disclosed methods involve (a) exposing a substrate to an aluminum-containing precursor, (b) purging the aluminum-containing precursor for a duration insufficient to remove substantially all of the aluminum-containing precursor in gas phase, (c) exposing the substrate to a nitrogen-containing precursor to form aluminum nitride, (d) purging the nitrogen-containing precursor, and (e) repeating (a) through (d). Increased growth rate and 100% step coverage and conformality are attained.


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