The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Dec. 14, 2012
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Manfred Schneegans, Vaterstetten, DE;
Bernhard Weidgans, Bernhardswald, DE;
Franco Mariani, Regensburg, DE;
Alexander Heinrich, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01); H01L 29/45 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/3677 (2013.01); H01L 29/45 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip including a first main face and a second main face. The second main face is the backside of the semiconductor chip. The second main face includes a first region and a second region. The second region is a peripheral region of the second main face and the level of the first region and the level of the second region are different. The first region may be filled with metal and may be planarized to the same level as the second region.