The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jun. 17, 2011
Applicants:
Minoru Ueshima, Tokyo, JP;
Yoshimi Inagawa, Tokyo, JP;
Minoru Toyoda, Tokyo, JP;
Inventors:
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 1/00 (2006.01); C22C 12/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/264 (2013.01); B23K 1/0016 (2013.01); B23K 35/26 (2013.01); C22C 12/00 (2013.01); H05K 3/3463 (2013.01); B23K 2201/42 (2013.01); H05K 3/3494 (2013.01);
Abstract
A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.