The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Mar. 10, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, JP;

Inventors:

Michio Horiuchi, Nagano, JP;

Ryo Fukasawa, Nagano, JP;

Yuichi Matsuda, Nagano, JP;

Yasue Tokutake, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H01L 21/486 (2013.01); H01L 23/142 (2013.01); H01L 23/49827 (2013.01); H05K 3/4038 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/0315 (2013.01);
Abstract

A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers.


Find Patent Forward Citations

Loading…