The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Mar. 13, 2013
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Chengjie Zuo, Santee, CA (US);

Jonghae Kim, San Diego, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Je-Hsiung Lan, San Diego, CA (US);

Daeik D. Kim, San Diego, CA (US);

Changhan Yun, San Diego, CA (US);

David F. Berdy, West Lafayette, IN (US);

Robert P. Mikulka, Oceanside, CA (US);

Matthew M. Nowak, San Diego, CA (US);

Xiangdong Zhang, Westford, MA (US);

Puay H. See, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/46 (2006.01); H03H 3/00 (2006.01); H05K 1/16 (2006.01); H01L 23/64 (2006.01); H03H 1/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H03H 7/01 (2006.01); H01F 17/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H03H 7/461 (2013.01); H01L 23/64 (2013.01); H03H 3/00 (2013.01); H03H 7/463 (2013.01); H05K 1/165 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0026 (2013.01); H01L 23/15 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 2924/0002 (2013.01); H03H 7/1758 (2013.01); H03H 7/1766 (2013.01); H03H 7/1791 (2013.01); H03H 2001/0021 (2013.01); H05K 1/0233 (2013.01); H05K 1/0306 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.


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