The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

May. 06, 2011
Applicants:

Tatsuya Shimoda, Nomi, JP;

Eisuke Tokumitsu, Kanazawa, JP;

Takaaki Miyasako, Mie, JP;

Toshihiko Kaneda, Nagano, JP;

Inventors:

Tatsuya Shimoda, Nomi, JP;

Eisuke Tokumitsu, Kanazawa, JP;

Takaaki Miyasako, Mie, JP;

Toshihiko Kaneda, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/66 (2006.01); B41J 2/16 (2006.01); C23C 18/12 (2006.01); B05D 5/06 (2006.01); H01L 21/02 (2006.01); H01L 21/368 (2006.01); H01L 29/786 (2006.01); H01L 41/33 (2013.01); H01L 41/318 (2013.01); H01L 27/12 (2006.01); C23C 18/06 (2006.01); H01L 21/441 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); B05D 5/06 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1629 (2013.01); B41J 2/1637 (2013.01); B41J 2/1639 (2013.01); B41J 2/1643 (2013.01); B41J 2/1645 (2013.01); C23C 18/06 (2013.01); C23C 18/1216 (2013.01); C23C 18/1254 (2013.01); C23C 18/1279 (2013.01); C23C 18/1283 (2013.01); C23C 18/1295 (2013.01); H01L 21/02104 (2013.01); H01L 21/368 (2013.01); H01L 21/441 (2013.01); H01L 27/1225 (2013.01); H01L 27/1292 (2013.01); H01L 29/786 (2013.01); H01L 29/7869 (2013.01); H01L 41/318 (2013.01); H01L 41/33 (2013.01); H01L 21/0237 (2013.01); H01L 21/02521 (2013.01); H01L 21/02601 (2013.01); H01L 21/02628 (2013.01); H01L 41/0973 (2013.01);
Abstract

A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.


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