The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Jan. 06, 2011
Applicant:

Deyuan Xiao, Shanghai, CN;

Inventors:

DeYuan Xiao, Shanghai, CN;

Guo Qing Chen, Boise, ID (US);

Roger Lee, Eagle, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/782 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/845 (2013.01); H01L 27/1211 (2013.01); H01L 29/7855 (2013.01);
Abstract

A method for making an integrated circuit includes at least a tri-gate FinFET and a dual-gate FinFET. The method includes providing a semiconductor on insulator (SOI) substrate. The method also includes implanting impurities into the substrate for adjusting a threshold voltage. The method provides a nitride film overlying a surface region of the substrate and selectively etches the silicon nitride film to form a nitride cap region. The method etches the silicon layer to form a first and a second silicon fin regions. The nitride cap region is maintained on a portion of a surface region of the first silicon fin region. The method includes forming a gate dielectric, depositing a polysilicon film, and planarizing the polysilicon film by chemical mechanical polishing (CMP) using the nitride cap region as a polish stop. The method etches the polysilicon film to form gate electrodes. The method forms elevated source and drain regions.


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