The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Jul. 12, 2013
Mpi Corporation, Chu-Pei, Hsinchu Shien, TW;
Chia-Tai Chang, Chu-Pei, TW;
Chin-Yi Tsai, Chu-Pei, TW;
Chiu-Kuei Chen, Chu-Pei, TW;
Chen-Chih Yu, Chu-Pei, TW;
Chien-Chang Lai, Chu-Pei, TW;
Chin-Tien Yang, Chu-Pei, TW;
Hui-Pin Yang, Chu-Pei, TW;
Keng-Shieng Chang, Chu-Pei, TW;
Yun-Ru Huang, Chu-Pei, TW;
MPI CORPORATION, Chu-Pei, Hsinchu Shien, TW;
Abstract
A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.