The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jun. 06, 2014
Applicant:

Glo Ab, Lund, SE;

Inventors:

Carl Patrik Theodor Svensson, Palo Alto, CA (US);

Linda Romano, Sunnyvale, CA (US);

Scott Brad Herner, San Jose, CA (US);

Cynthia Lemay, Santa Clara, CA (US);

Assignee:

GLO AB, Lund, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 27/15 (2006.01); H01L 29/205 (2006.01); H01L 21/00 (2006.01); H01L 33/06 (2010.01); H01L 33/00 (2010.01); H01L 33/24 (2010.01); H01L 33/32 (2010.01); H01L 33/18 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01L 33/005 (2013.01); H01L 33/24 (2013.01); H01L 33/18 (2013.01); H01L 33/32 (2013.01);
Abstract

A semiconductor device includes a plurality of first conductivity type semiconductor nanowire cores located over a support and extending from portions of a semiconductor surface of the support exposed through openings in the insulating mask layer, and a plurality of semiconductor shells extending over the respective nanowire cores. Each of the plurality of semiconductor shells includes at least one semiconductor interior shell extending around the respective one of the plurality nanowire cores, and a second conductivity type semiconductor outer shell extending around the at least one semiconductor interior shell. A first electrode layer contacts the second conductivity type semiconductor outer shell of the plurality of semiconductor shells and extends into spaces between the semiconductor shells. The semiconductor interior shell includes a semiconductor foot portion which extends under the first electrode and under the respective second conductivity type semiconductor outer shell on the insulating masking layer in the spaces between the plurality of semiconductor shells.


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