The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Apr. 09, 2013
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Ching-Ling Lin, Kaohsiung, TW;
Po-Chao Tsao, New Taipei, TW;
Chia-Jui Liang, Tainan, TW;
Chien-Ting Lin, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/308 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); H01L 21/823468 (2013.01); H01L 21/823864 (2013.01); H01L 29/66795 (2013.01);
Abstract
A method for manufacturing semiconductor structures includes providing a substrate having a plurality of mandrel patterns and a plurality of dummy patterns, simultaneously forming a plurality of first spacers on sidewalls of the mandrel patterns and a plurality of second spacers on sidewalls of the dummy patterns, and removing the second spacers and the mandrel patterns to form a plurality of spacer patterns on the substrate.