The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Jan. 08, 2014
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Erh-Kun Lai, Taichung, TW;

Guan-Ru Lee, Kaohsiung, TW;

An-Chyi Wei, Hsinchu, TW;

Hang-Ting Lue, Zhubei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 27/115 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0603 (2013.01); H01L 27/11578 (2013.01); H01L 29/401 (2013.01); H01L 29/7843 (2013.01);
Abstract

A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a substrate, a stacked strip structure, and a tensile material strip. The stacked strip structure is formed vertically on the substrate, the stacked strip structure having compressive stress. The stacked strip structure comprises a plurality of conductive strips and a plurality of insulating strips, and the conductive strips and the insulating strips are interlaced. The tensile material strip is formed on the stacked strip structure, the tensile material strip having tensile stress.


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