The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Aug. 16, 2013
Win Semiconductors Corp., Kuei Shan Hsiang, Tao Yuan Shien, TW;
Chang-Hwang Hua, Tao Yuan Shien, TW;
Chih-Hsien Lin, Tao Yuan Shien, TW;
WIN SEMICONDUCTORS CORP., Tao Yuan Shien, TW;
Abstract
A structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof. The structure comprises a substrate, at least one backside metal layer, at least one first metal layer, at least one electronic device, and at least one metal bump. The substrate has at least one substrate via hole penetrating through the substrate. The at least one first metal layer and electronic device are formed on the front side of the substrate. The at least one metal bump is formed on the at least one first metal layer. The at least one backside metal layer is formed on the backside of the substrate covering the inner surface of the substrate via hole and at least part of the backside of the substrate and connected to the first metal layer on the top of the substrate via hole.