The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Oct. 16, 2013
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/67 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67057 (2013.01); B32B 43/006 (2013.01); H01L 21/67092 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1126 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1933 (2015.01);
Abstract
A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank.
Yoshino, Michirou. (2015). Wafer separating apparatus and wafer separating method (U.S. Patent No. 9190301). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9190301
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile