The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

May. 03, 2013
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Costel Biloiu, Rockport, MA (US);

David P. Sporleder, Billerica, MA (US);

Jay Scheuer, Rowley, MA (US);

Neil Bassom, Hamilton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/00 (2006.01); C23F 4/00 (2006.01); H01J 37/305 (2006.01); H01J 27/08 (2006.01); H01J 37/08 (2006.01);
U.S. Cl.
CPC ...
C23F 4/00 (2013.01); H01J 27/08 (2013.01); H01J 37/08 (2013.01); H01J 37/3053 (2013.01); H01J 2237/022 (2013.01); H01J 2237/3341 (2013.01);
Abstract

An ion source includes an ion source chamber, a cathode disposed within the ion source chamber and configured to emit electrons to generate an arc plasma, and a repeller configured to repell electrons back into the arc plasma. The ion source chamber and cathode may comprise a refractory metal. The ion source chamber further includes a gas source configured to provide a halogen species to the ion source chamber. The reactive insert is interoperative with the halogen species to yield a first etch rate of the refractory metal material within the ion source chamber under a first set of operating conditions that is less than a second etch rate of the refractory metal material within the ion source chamber under the first set of operating conditions when the reactive insert is not disposed within the ion source chamber.


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